Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Apr 16, 2026
Singapore, April 16: Silicon Box, an industry leader in advanced semiconductor packaging solutions, today announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognized as a critical solution to address rising costs and bottlenecks amidst rapidly increasing computing requirements for modern, software-defined vehicles. Silicon Box will support the ACP's research initiative with its end-to-end know-how in chiplet interconnection, from consulting on optimal chiplet architecture for sustainable and scalable technology roadmaps, to turnkey solutions for advanced packaging and testing.
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